活動形式：攤位展示
活動介紹： Broadcom 參展 HPE Discover More AI Taipei 2025，與產業先進齊聚一堂，共同探索 AI、雲端與資料中心的創新應用與發展趨勢。現場透過攤位展示，以 DM、贈品與互動交流吸引來賓駐足，期望深化與產業夥伴的合作機會，凸顯其在企業級基礎設施與雲端儲存領域的深厚實力。
Format: Booth Exhibition
Description: Broadcom joined HPE Discover More AI Taipei 2025, uniting industry leaders to explore AI, cloud, and data center innovations. Through booth displays and incentive program, highlighting its strong expertise in enterprise infrastructure and cloud storage.
活動形式：論壇 / 攤位展示
活動介紹：AMD Radeon™ AI Tech Day 勝邀國外長官及相關研發團隊親臨現場，親自介紹並帶領來賓深入探討 Radeon ™ AI Pro 系列產品應用，進一步強化產業交流與合作契機。現場亦展示 AMD Radeon™ AI PRO 系列顯卡等最新設備，吸引眾多來賓熱情參與，展現 AMD 在 AI 技術發展與產業應用上的領導地位。
Format: Session / Booth
Description: AMD Radeon™ AI Tech Day invited international executives and R&D teams to showcase the Radeon™ AI Pro series, featuring live demonstrations of AMD Radeon™ AI PRO GPUs and highlighting AMD’s leadership in AI technology and applications.
活動形式：議程 / 攤位展示
活動介紹：2025 AMD 年度盛會，精彩主題論壇邀請台灣人工智慧學校、群聯電子及 DIGITIMES 共同探討 AI 運算趨勢，掌握多元 AI 解決方案的實際應用。現場集結超過 30 家合作夥伴及 AMD 兩大主題展示攤位，吸引近千位貴賓共襄盛舉，充分展現 AMD 在 AI 與算力領域的領導地位，成功深化品牌專業形象並擴大市場影響力。
Format: Forum／Booth Exhibition
Description: The 2025 AMD AI Solutions Day centered on AI computing trends and practical applications of diverse AI solutions. Uniting 30+ ecosystem partners and two AMD booths, attracting nearly 1,000 guests and showcasing leadership and professional strength of AMD in AI and computing power.
活動形式：攤位展示
活動介紹：AMD 與 Microsoft Azure 聯合參展 Siemens EDA Forum 2025，攜手業界先進共同探討 EDA 的創新趨勢與應用。活動現場透過攤位展區，向與會來賓展示 AMD 高效能運算與 AI 加速技術。攤位特別規劃專業技術交流與問卷互動體驗，不僅增進了與來賓的交流，也有效提升了品牌能見度。
Format: Booth Exhibition
Description: AMD in alliance with Microsoft Azure to showcase at Siemens EDA Forum 2025, joining industry leaders to explore EDA innovations. Through booth displays, guests experienced AMD’s HPC and AI technologies. With interactive exchanges and surveys enhancing engagement and brand visibility.
活動形式：攤位展示 / 議程
活動介紹：AMD 參展 Google Cloud Summit Taipei 年度盛會，邀請與會來賓與專業團隊交流，透過 CloudTalk 議程及攤位展區，深入了解 AMD AI 運算解方與最先進產品技術。展區精心設置交流互動及填問卷活動，蒐集潛在客戶資訊，增加與來賓的互動，深植品牌印象，提供來賓難忘的參展之旅。
Format: Booth Exhibition / Session
Description: AMD showcased the AI solutions at Google Cloud Summit Taipei. Through CloudTalk session and booth displays, guests explored advanced technologies. Interactive activities and surveys helped gather leads and boost engagement, strengthening brand impressions.
活動形式：議程 / 內部會議
活動介紹：作為年度技術交流盛會，AMD Tech Day 邀集眾多合作夥伴共襄盛舉，聚焦 AMD Ryzen™ 處理器技術與AI 關鍵應用。活動現場貴賓雲集，透過多元分享與技術展示，全面展現 AMD 在高效能運算與人工智慧領域的技術實力，深化產業連結與創新合作契機。
Format: Session / Internal Meeting
Description: As AMD’s annual technical event, AMD Tech Day brought together a wide range of valued partners to explore the latest solutions in AMD Ryzen™ technology and key AI applications. It also served to deepen industry connections and foster new opportunities for collaborative innovation.
活動形式：晚宴
活動介紹：2025 COMPUTEX 期間，AMD 於高空酒吧舉辦慶祝晚宴，邀請來自各地的代理商與夥伴齊聚一堂，感謝長期以來的支持與信賴。現場佈置別出心裁，除了優雅中帶點活潑的氣球裝飾，也設置拍照背板區，讓賓客留下美好回憶。透過溫馨交流與熱絡氣氛，AMD 與夥伴共度難忘之夜，共迎 AI 世代的全新契機。
Format: Banquet
Description: AMD brought partners together for a vibrant evening during COMPUTEX 2025. With festive details like balloons, a photo backdrop, and stunning city views, the night celebrated shared success, warm connections, and a collective step forward into the future of AI power.
活動形式：攤位展示
活動介紹：於 COMPUTEX 展期間，AMD 打造 Demo Showcase，透過互動講解與實機操作，展現高效能運算與 AI 技術的應用實力。現場除展示頂尖裝置與處理器外，亦設置合作夥伴 Logo 牆，強化產業聯盟形象，吸引業界代表與媒體參與，展現 AMD 在運算領域的領導地位。
Format: Booth Exhibition
Description: At COMPUTEX, AMD showcased its high-performance computing and AI technologies through interactive display, attracting media and key industry representatives. The showroom demonstrate AMD’s strong partner ecosystem and the leading position in industry.
活動形式：攤位展示
活動介紹：2025 首次攜手 Tricentis，協助籌備 SAP NOW AI Tour Taiwan 參展事宜，包含攤位設置、宣傳與影片展示。以品牌風格為基礎，打造視覺吸睛且具互動性的展區，有效提升現場曝光與參與度。此次合作展現我們從規劃到執行的一條龍服務，成功塑造 Tricentis 鮮明品牌形象。期待持續合作，共創亮眼成果。
Format: Booth Exhibition
Description: In 2025, we teamed up with Tricentis for the first time to support their presence at SAP NOW AI Tour Taiwan. From booth design to promotional content, we delivered an engaging and brand-aligned experience that boosted visibility and interaction. We look forward to more great collaborations ahead!
活動形式：議程 / 攤位展示
活動介紹：SAP 年度論壇熱烈開展，吸引上千位產業領袖與專家共襄盛舉。上午業界翹楚對談率先重磅登場，下午聚焦五大 AI 應用主題分論壇。現場精心打造 SAP 互動體驗區，並集結 18 家策略夥伴聯展，透過創新科技與智慧體驗，帶領企業發掘商業 AI 新契機，共創智慧轉型的未來藍圖。
Format: Session／Booth Exhibition
Description: SAP annual forum gathered 1,000+ industry leaders, with keynote, panel and five breakout session featuring AI solutions. SAP interactive zone and 18 partner booths highlighted innovative tech, driving businesses to discover AI potential and future collaboration.